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Home arrow Blogs arrow Chip Shots arrow Blogs arrow IEDM preview: Looks like another propeller-head extravaganza
IEDM preview: Looks like another propeller-head extravaganza Print E-mail
Dec 07, 2006 at 10:30 AM
iedm_logo.jpg

The propeller-headed minions of semiconductor and nanoelectronics technology descend on San Francisco next week for the International Electron Devices Meeting (IEDM). A perusal of the conference agenda reveals the usual panopoly of cutting-edge research and development papers, with a handful thrown in from the manufacturing ranks for good measure, as well as brainteasing plenary and lunch talks.

Rather than offer a laundry list of sessions and paper titles, I've uploaded some images and descriptive blurbs from a few presentations.

13.2_fig2.jpg

The image above shows a cross-section of a ten-level interconnect stack created with a BEOL process developed by the IBM-AMD-Sony-Toshiba alliance. The authors' paper, part of IEDM Session 13, describes how the technology is "the first successful implementation of copper and ultra-low-k dielectric material (a porous SiCOH cocktail with k value of 2.4) to meet reliability qualification criteria." They claim they can CMP the dielectric, which has hitherto been very difficult to do.

21.1_fig 5.jpg

The SEM photo above reveals a cross-section of an embedded DRAM cell developed by a team at Big Blue. Part of a 65-nm silicon-on-insulator (SOI) processor, the 2-Mb eDRAM has a 0.127-square-micron memory with 1.5-nanosecond access times, said to be the fastest result ever for such a cache. The embedded device is highly scalable and won't compromise the neighboring logic elements, according to the authors who will present their findings in Session 21.
28.2_fig1.jpg

This SEM shot of an intriguing microgizmo offers details of a postprocessed die and giant magnetoresistive (GMR) biosensor array used for DNA analysis. Built by scientists at Stanford University, the biochip features more than a thousand sensing elements within a square millimeter and was integrated with quarter-micron BiCMOS chip circuitry. Possible future applications include low-cost, portable medical diagnostic instruments. The work will be presented in Session 28.

Look for my IEDM reports and musings direct from San Francisco next week on Chip Shots.
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