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Home arrow Product Briefings arrow Cleanroom arrow Simplified packaging allows standardised 300mm FOSB transportation
Simplified packaging allows standardised 300mm FOSB transportation Print E-mail
Oct 08, 2004 at 11:00 PM
ImageProduct Briefing Outline: 3M has expanded its Wafer Transport System portfolio of products and services to include a solution for 300mm wafers. The 3M Wafer Transport System maximizes the wafer packing and shipping processes by helping to protect high-value semiconductor products, better manage waste and decrease wafer transport costs.

Problem: The number of fabrication sites that will produce 300mm wafers is expected to grow 74 percent in 2004. This will result in the number of 300mm wafers produced and shipped to increase to 11.5 million in 2006, up from 7.5 million in 2004, according to SEMI's Silicon Manufacturing Group (SMG) 2003 Consensus Forecast. The 300mm wafer transport system is designed to support the shift to larger and thinner wafers, while decreasing costs and breakage.

Solution: The combination of the 3M Horizontal Wafer  Shipper with 3M Air Cushion Packaging is claimed to decrease overall shipping costs by as much as 70%. The Horizontal Wafer Shipper is a robust solution that decreases wafer breakage-provides high-impact strength, durability and superior static protection. The 3M Horizontal Wafer Shipper also protects wafers from ionic and out-gassing damage. It is also claimed to be the first to offer an optional seal to reduce corrosion, decrease contamination and reduce moisture vapor transmission which may even eliminate the need for a secondary barrier bag.
The 3M Air Cushion Packaging (ACP) for 300mm wafer front opening shipping boxes (FOSB) eliminates the need for bubble wrap, (reduces dimensional weight by 50%), which adds excess cost and decreases assembly time. Its ease-of-use offers customers a more seamless packing and shipping process while demonstrating high-quality performance through analytical testing capabilities provided by ISTA-certified drop test laboratories.

Applications: 150mm, 200mm, and 300mm wafer sizes.

Platform: Using six sigma methodology, which drives decision-making based on data and helps customers drill down to find the root causes of process inefficiencies, experts from 3M can support customers in their efforts to achieve global standardization.

Availability: July 2004 onwards.
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