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Enhanced small spot measuring capability for test pads & scribe lines |
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Feb 04, 2005 at 05:00 PM |
 Product Briefing Outline: The BedeMetrix™ X-ray
metrology tools now provide enhanced small spot measuring capability
for semiconductor wafers from 50mm to 300mm. This new capability allows
for measurement of sub-100 micron test pads in chips and scribe lines
on processed wafers.
Problem: This leading-edge small spot measuring capability provides
automated characterization of numerous semiconductor fabrication
processes, substantially increasing cost control and yield enhancement
over other metrology methods. Typical applications for the BedeMetrix™
include product range, epilayer composition and thickness,
polycrystalline layer thickness, phase and texture, pore size, and pore
size distribution.
Solution: The BedeMetrix™-L is a leading multipurpose research and
process development metrology tool for advanced semiconductor
manufacturing. This sophisticated tool measures not only thickness, but
the fundamental material properties and structures of materials,
including epitaxial and non-epitaxial layers.
Applications: Epilayer composition and thickness, polycrystalline layer
thickness, phase and texture, pore size, and pore size distribution.
Its new capability allows for measurement of sub-100 micron test pads
in chips and scribe lines on processed wafers.
Platform: The tool features complete automation in wafer loading,
alignment, measurement, and interpretation, with simple and rapid
interchange between applications.
Availability: 2004 onwards.
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Product Briefings 
