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Single-platform architechture for advanced contact and via-fill |
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Feb 04, 2005 at 09:00 PM |
 Product Briefing Outline: Novellus Systems, has
launched "ALTUS DirectFill" - a single-system solution designed to meet
contact and via-fill needs at 65 nm and below. DirectFill eliminates
the need for conventional titanium/titanium nitride (Ti/TiN) toolsets.
This advanced plug-fill technique can reduce contact resistance (Rc)
and lower overall cost of ownership (CoO) by 50 percent or more when
compared to existing processes, the company claims.
Problem: ALTUS DirectFill simplifies the tungsten deposition process by
replacing the standard multi-tool, Ti/TiN/W approach with a single
system. This system integrates an advanced preclean process in one
process module, followed by Novellus' proprietary, pulsed nucleation
layer (PNL) deposition of tungsten nitride (WN) in a second module, and
then a combined PNL and chemical vapor deposition (CVD) tungsten (W)
deposition in a third module. The multi-station sequential deposition
process modules used for WN and W are claimed to deliver high
productivity and process reproducibility.
Solution: ALTUS DirectFill technology provides several key technical
benefits. First, the tungsten nitride barrier exhibits atomic layer
deposition (ALD) conformality and is substantially thinner than the
Ti/TiN linerbarrier it replaces, allowing more of the contact to be
filled with lower resistivity tungsten. The tungsten nitride/low
resistivity tungsten DirectFill process can reduce contact plug
resistance by as much as 50 percent at the 45-nm node. Additionally,
PNL tungsten nitride provides excellent barrier characteristics for
tungsten and adheres to a variety of dielectric materials. All process
temperatures are below 4000C, providing compatibility with future
process integration requirements. Unlike competitive systems, ALTUS
DirectFill technology solves fill problems at advanced nodes without
compromising resistivity.
Applications: Includes current tungsten deposition applications, such
as contact and bit line, while enabling future applications, such as
capacitor electrode and metal gate electrode below the 65nm node.
Platform: The new tool is available in both 200-mm (Concept Two ALTUS
DirectFill) and 300-mm (Concept Three ALTUS DirectFill) configurations.
Availability: November 2004 onwards.
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Wafer Processing 