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Precise dopant placement in high-productivity medium current implanter |
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Feb 04, 2005 at 11:00 PM |
Product Briefing Outline: Varian Semiconductor Equipment
Associates, has launched a single wafer VIISta 810XE medium current
ion implanter. Based on the VIISta 810EHP, the VIISta 810XE is
designed to deliver the highest productivity and process performance. Multiple
orders for the VIISta 810XE have already been received. The initial shipments
will go to a DRAM manufacturer in Taiwan, according to the company.
Problem: Precise dopant placement and low contamination levels
are critical to achieve tighter control of the parametric implants
needed in today's advanced transistors. At the same time, industry
economics require the most productive implant solutions over the entire
application space.
Solution: The VIISta 810XE's patented dose control system
ensures precise implanting for high volume production. Repeatable and
accurate implant angle control is a critical parameter for advanced
devices. The closed loop "Varian Positioning System" (VPS) delivers
accurate and repeatable angle control over the full range of desired
implant angles. The unique beamline design delivers low metals,
particle, cross-species and energy contamination levels. The unique
dual magnet design reduces downstream beamstrike, which is the dominant
mechanism in the generation of metals, particle and cross-species wafer
contamination. Unlike single-magnet implanters, final ion acceleration
is done before the analyzer magnet, eliminating the potential for
energy contamination associated with downstream charge exchange.
Applications: Medium Current Ion Implanter... 2keV - 810keV the
VIISta 810XE also supports a 900keV extended energy range option which
provides the highest productivity for a large number of well
applications.
Platform: The VIISta platform of ion implanters is the only
single wafer platform solution for all production applications
available. All of the VIISta products feature the Varian Control System
(VCS), the Varian Positioning Systems (VPS) and a common single wafer
end-station. This high degree of commonality across the VIISta platform
facilitates process matching throughout the tool set and provides
flexibility in managing capacity, product mix changes, spare parts and
training.
Availability: October 2004 onwards.
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