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Consistant copper control |
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Feb 04, 2005 at 03:00 PM |
 Product Briefing Outline: ECI Technology
has announced the launch of its "QUALI-LINE QLC-8500" system. The
QLC-8500 is an online chemical monitoring system for electroless baths
used in VLSI damascene Cobalt capping applications. In addition to the
proven CVS and Titration techniques, the QLC-8500 adds Spectroscopy,
Oxidation Reduction Potential (ORP), Particle Count and many other
critical capabilities to analyze and control electroless deposition.
Multiple orders have already been booked, according to the company.
Problem: Electroless processes use more chemical components than copper
electroplating, and the corresponding solutions are inherently
unstable. Effective chemical monitoring is therefore critical towards
the success of electroless deposition. Solution: The QLC-8500's unique
design allows samples to be analyzed by multiple techniques
simultaneously, greatly speeding up the process. Its software scheduler
enables sophisticated yet flexible control over timing, frequency, and
sequence of analysis. Better than 3-5% accuracy and 2-4% repeatability
on analyses of all non-metal components. It uses spectroscopy with
proprietary algorithms to promptly report metal concentration with
extremely high precision.
Applications: VLSI Damascene Cobalt Capping. Damascene Seed Layer
Repair/Enhancement. Copper Interconnect (by Electroless Deposition).
Nickel Plating for MEMS and PCB Applications. It also provides
information on all key chemical components including cobalt, copper,
tungstate, palladium, reducing/ complexing/buffering agents, pH
adjuster and background ions.
Platform: The Quali-Line QLC-8500 expands from the functionalities of
the industry-leading QLC-7000 Chemical Monitoring System for copper
electroplating. In addition to the proven CVS and Titration techniques,
the QLC-8500 adds Spectroscopy, Oxidation Reduction Potential (ORP),
Particle Count and many other critical capabilities to analyze and
control electroless deposition.
Availability: February 2005 onwards.
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Product Briefings 