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Metal film thickness and composition measurement |
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Feb 04, 2005 at 04:00 PM |
Product Briefing Outline: Thermo Electron Corporation has
announced the release of its latest X-ray fluorescence instrument for
semiconductor metrology, the "MicroXR" microbeam XRF platform. Designed
for on-line and nearline measurements on semiconductor wafers, optical
devices, high-density chip-scale packaging and substrate applications,
the MicroXR presents particular benefits for the semiconductor and
microelectronics markets.
Problem: Different metals will affect an instrument's
calibration. The need for advanced X-ray system and software programs
will reduce the need for multiple calibrations, save time and improve
the measurement and accuracy.
Solution: The MicroXR uses a unique combination of microbeam
X-ray collimation technology and traditional energy dispersive XRF
(EDXRF) spectroscopy. The end result is a non-destructive metrology
technique that measures the thickness and composition of up to five
layers of deposited metals simultaneously. Metal film thickness ranges
from micron to angstrom levels. The new XRF platform can also determine
bulk alloy composition for up to 20 elements. The use of optically
collimated X-rays delivers intensity gains of up to 1,000 times over
traditional XRF tools. X-rays generated by a 50W X-ray tube are
redirected and focused on the sample surface. The resulting intensity
on the sample surface is equivalent to the intensity generated by a
50kW X-ray tube. Solid state detector technology, which operates
without liquid nitrogen cooling, in combination with digital pulse
processing, guarantees high count rate throughput performance. This
technology is claimed to dramatically reduces measurement time while
greatly increasing accuracy, precision and reproducibility.
Applications: Measures the thickness and composition of up to
six layers of deposite metals simultaneously, from angstrom to micron
thickness ranges. It can also determine bulk alloy composition for up
to twenty elements.
Platform: The MicroXR series is available in benchtop, console,
and automated wafer handling configurations. The console and wafer
handler models incorporate an embedded vibration isolation system and
are compatible with most wafer sizes (150, 200 and 300 mm). The
platform can be configured with different types of optical collimators
and X-ray detectors. Patented Vacuum Conduit technology provides near
vacuum measurement performance while leaving the sample under
atmosphere, a unique feature that enables the measurements of elements
down to aluminum. The wafer handler configuration includes the MicroXR
console system and an automated equipment front-end module (EFEM). It
is Class 1 cleanroom ready, and compliant with CE and SEMI S2 and S8
requirements.
Availability: December 2004 onwards.
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Product Briefings 