Home
News
Blogs
Fabtech Jobs
Product Briefings
Going Places
300mm Activity Reports
Core Sections
Wafer Processing
Lithography
Fab management
Materials & Gases
Critical Components
Cleanroom
EHS
 
Find

GlobalSpec - The Engineering Search Engine
 
Home arrow Fab management arrow News arrow Fab Management arrow Book-to-Bill down 25 percent y-on-y in September
Book-to-Bill down 25 percent y-on-y in September Print E-mail
Oct 22, 2007 at 10:51 AM

SEMIThe book-to-bill ratio for North American-based manufacturers of semiconductor equipment continued to fall month-on-month in September to a ratio of 0.81. This is a decline of 25 percent compared to the same month last year. Suppliers reported $1.23 billion in orders in September 2007, according to SEMI. The bookings figure is also down about 10 percent from the final August 2007 level of $1.37 billion. 

"New equipment orders have dipped to levels last seen in late 2005 and early 2006," said Stanley T. Myers, President and CEO of SEMI. "We are seeing orders decline from the peak levels earlier this year, which were driven largely by strong investments in 300mm memory capacity."

The three-month average of worldwide billings in September 2007 was $1.51 billion.

SEMI 

 


Readers' comments



Bookmark with:
DeliciousDiggredditStumbleUpon

Visit Fabtech Jobs websiteSubscribe to Fabtech weekly newsletter

Related articles
Equipment book-to-bill ratio trend up slightly   (22/02/2008)
SEMI Book-to-Bill in slump  (20/09/2007)
SEMI book-to-bill ratio of 0.84 lowest in years  (17/08/2007)
Book-to-bill ratio remains strong  (16/03/2007)
Semiconductor equipment book-to-bill ratio continues decline in October  (17/11/2006)

Related jobs
Engineering Project Manager  (Alzenau, 28/03/2008)
Manager, Facilities and Support Services  (PERRYSBURG, 19/03/2008)
Senior Component Design Engineer  (Intel Shannon, Co Clare, Ireland, 19/03/2008)
Customer Engineer  (, 04/03/2008)
Ingenieur Conception analogique/mixte Power Management   (Toulouse, 19/02/2008)
Download
300mm