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Total repair solution for advanced photomasks |
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Feb 04, 2005 at 11:00 PM |
 Product Briefing Outline: FEI has released the what it
believes to be the industry's firstever "DualBeam" mask repair system
designed to repair photolithography mask defects for the 65 nm node.
Combining both a focused ion beam (FIB) column and an environmental
scanning electron microscope "ESEM" in a single system, the new "Accura
XT+," is a solution that can accommodate both today's photomasks and
extend to a broad set of next-generation lithography technologies.
Problem: Today's advanced masks already cost hundreds of
thousands of dollars and can be ruined by a single defect. The Accura
XT recovers these masks by repairing any defect, thereby reducing costs
and speeding delivery times to customers. FEI's ESEM technology has the
advantage of eliminating the adverse charging effects of standard SEMs.
The third generation IntuitION graphical user interface employing
features such as pattern copy and Dynamic Registration allows operators
to recover even the most complex OPC feature masks. Unlike laser repair
systems, the Accura XT provides the flexibility of repairing both
clear, opaque, and quartz bump defects.
Solution: FEI's patented environmental SEM technology enables
e-beam repair of leading-edge 65nm photomask types while also providing
high-resolution e-beam imaging. The system also features an optical
microscope for easy mask navigation and global alignment. The Accura
XT+ delivers clean, high transmission repairs with excellent edge
placement. The Accura XT is also tightly integrated with the FEI SNP
Stylus Nanoprofilometer mask metrology tool. Together, the tools
provide a complete repair and metrology solution for the photomask
customer. The SNP is used to characterize detailed 3D contour maps of
APSM defects, allowing the Accura to precisely remove otherwise
un-repairable quartz defects.
Applications: Photolithography mask defects for the 65nm node as
well as EUV reflective, LEEPL/Stencil, Nanoimprint, CPL, and new
absorber stacks. The Accura XT is designed for repairing defects on
MoSiON phase shift, alternating phase shift, chrome binary, and optical
proximity correction masks.
Platform: A new VisIONary FIB column provides smaller spot size
and more accurate beam placement for both imaging and repair. Also
introduced with the Accura XT+ is CAD Copy, a software upgrade designed
to boost the system's Pattern Copy software. The software package
enables the repair of previously irreparable defects on single die
masks and accesses archived CAD data from mask writer tools to generate
highly accurate repair bitmaps.
Availability: September 2004 onwards.
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Product Briefings 
