By Mark Thirsk and Mike Corbett, Linx Consulting LLC, USA

ABSTRACT

For at least the last 20 years, lithography has enabled the increase in density that has sustained the rapid increase of functionality that has been key in the development of the electronics industry.  Today, lithography faces physical, chemical and business challenges in delivering the patterning densities required by the ITRS (International Technology Roadmap for Semiconductors). The pressure to achieve the next node (even in name) before the competition accelerates the development progress from an anticipated 3-year to a 1.5- or 2-year cycle is intense.  This pace to improve resolution puts huge strains on the lithographer, and indeed on all involved in transferring the pattern to the substrate.  However, the need to meet future requirements is leading to several new trends in lithography and patterning.