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Home arrow Materials & Gases arrow Articles arrow Edition 33 arrow 33rd Edition: Challenges and approaches for introducing TM...
33rd Edition: Challenges and approaches for introducing TMAl into R&D fab processing Print E-mail
Apr 10, 2007 at 03:34 PM

By Don Baskin and Paul Scheibmeir, ATDF, Texas, USA

ABSTRACT

Atomic layer deposition (ALD) has become a leading technology candidate for enabling the semiconductor industry to fabricate devices below 90nm and forge into the realm of nanotechnology.  One of the most effective precursors for ALD is trimethylaluminum (TMAl), a pyrophoric liquid that ignites upon contact with air and reacts violently with water or atmospheric moisture.  Because of its reactivity, TMAl requires strict safety protocols for handling, containment, and use.  Becoming familiar with andadopting these procedures may require a steep learning curve and rapid assimilation of new safety regiments.  Such was the experience of ATDF, the global R&D foundry based in Austin, TX.

33rd Edition: Challenges and approaches for introducing TMAl into R&D fab processing
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