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BASF teams with IMEC on 32nm cleaning solutions |
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Oct 08, 2007 at 10:50 AM |
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 BASF has joined IMEC’s Industrial Affiliation Program to research and develop new cleaning solutions that are intended to reduce the complexity of wafer processing at the 32nm node and below.
“New and less complex manufacturing processes are a must for future IC technologies to be viable. IMEC is delighted to work with the BASF research team which has a broad chemical expertise. We believe that the increasing challenges of the IC industry can only be overcome by joint interdisciplinary teams,” said Serge Vanhaelemeersch, department Director for advanced materials and process steps at IMEC.
The collaboration between BASF and IMEC is intended to identify and qualify cleaning chemicals that reduce the complexity and the number of IC production steps by improving chemical performance.
“BASF is committed to providing intelligent solutions for our customers. That is why our strategy is to work with top partners in the world on the next generation technology for the IC industry,” said Dr. Andreas Klipp, Manager of Development of Semiconductor Materials Europe of BASF Electronic Materials. “By combining IMEC’s strengths with BASF’s broad chemical and application know-how, we can develop innovative cleaning solutions for enabling IC manufacturing processes using 32nm technology.”
The new chemical cleaning solutions intended to be commercialized with the introduction of 32nm technology in 2010.
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