Product Briefing Outline: Tokyo Electron (TEL) has said that starting October 1, 2007, the company will begin receiving orders for the ‘Trias’ High-k CVD system. The new system is a 300mm single-wafer cluster tool designed to produce thin-film materials required for the advanced gate stack, which will be incorporated in the most advanced semiconductor devices at the 45nm node and beyond, according to the company. 

Problem: Improvements in transistor speed have historically been accomplished in part by continuously reducing the thickness of the SiO2-based gate insulator through a process known as scaling. However, thinning the gate dielectric to improve transistor speed comes with the price of increased electrical leakage through the dielectric, a factor that negatively impacts power consumption, reliability, and other transistor performance parameters. This has driven an extensive industry-wide effort to develop new, high-permittivity (high-k) insulators to enable continued performance improvements in the nanometer-era of semiconductor devices.

Solution: TEL's Trias High-k CVD system enables the semiconductor industry to realize the promise of high-k dielectrics by combining highly-specialized 300mm process chambers on a production-proven platform. The heart of the Trias High-k CVD system is TEL's high-k deposition chamber, which is used to deposit hafnium-based high-k dielectrics. The high-k deposition system is based on TEL's single wafer CVD chamber, which incorporates proprietary refinements to optimize film performance. Process cycle times and mechanical throughput have been optimized to provide efficient, low-cost operation in a high-volume manufacturing environment, according to the company.

Applications: High-k CVD processes for 45nm and below.

Platform: Complementary to this chamber is TEL's UVRF system, a process chamber capable of forming monolayer-scale insulators that serve as the interface between the high-k dielectric and the silicon substrate. These interfacial films are a critical component in the advanced gate stack, and TEL's UVRF system is unique in its ability to form
electrically-sound, highly-uniform films in a production environment. TEL's SPA and LPA process chambers complete the Trias High-k CVD cluster. These enable the process engineer to refine and optimize the electrical and structural properties of the gate stack through chemical modification and thermal treatment.

Availability: October 2007 onwards.