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Tool Order: Surfect sells an Ascent 200 system to US bumping service provider |
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Oct 03, 2007 at 05:50 PM |
 A U.S.-based provider of semiconductor wafer bumping services has ordered an Ascent 200 tool from Surfect Technologies. The tool is to be supplied to the customer in January 2008, making it the first system to be installed and operated in the U.S., the company said.
"This purchase from a U.S. bumping house builds on our earlier success in Taiwan, and is further validation of our unique process and tooling capabilities," said Steve Anderson, Surfect's Chief Executive Officer. "Our plating tools are well suited for both small lot process development as well as large volume assembly. They give customers the ability to run 4 through 8 & 12-inch wafers and the flexibility to expand capacity incrementally.” The Acent 200 is a high speed plating platform using Surfect’s single-cell plating chamber for 200mm wafers.
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