Trina Solar Limited has signed an agreement with Meyer Burger AG for the supply of ID cropping, band and wire saws used for the production of its monocrystalline and multicrystalline wafers and cells. The contract, valued over $154million, covers equipment and delivery schedule to meet the capacity expansion goals of Trina through 2010.

"We are pleased to be able to support Trina Solar with the latest ID/OD, band and wire saw technology as it expands its wafer capacity and makes progress on its technology roadmap to reduce wafer thickness," said Peter Pauli, Meyer Burger's CEO. "We expect our subsidiary company Meyer Burger Machinery Shanghai to provide Trina Solar with the necessary level of customer support and quality assurance and we look forward to continue our successful cooperation in the future."