Online information source for semiconductor professionals

Tool Order: Singapore fab places multiple inspection system order with Rudolph

08 May 2008 | By Mark Osborne | News > Wafer Processing

Popular articles

Micron moving fast on Hynix in Q208 NAND flash rankings, says iSuppli - 19 August 2008

Numonyx to close California Technology Center - 12 August 2008

Qimonda starts major reorganization: exits PC DRAM market - 13 October 2008

Applied Materials sees higher CapEx spending for 2009 - 15 August 2008

Micron close to Inotera share purchase, says Gartner - 06 October 2008

RudolphA major chip manufacturer based in Singapore has placed a multiple (3) systems order with Rudolph Technologies for its recently introduced AXi 940 macro defect inspection module. According to Rudolph, the order was received after a successful evaluation process by the chip manufacturer for advanced lithography and CMP applications.

“The size of the order puts us ahead of our own projections for this tool,” commented Scott Balak, AXi inspection Product Manager, “but more significantly, it affirms the design choices we made and the value this customer recognizes in the resulting product. Clearly, the productivity, accuracy and reliability of the new tool were apparent in this evaluation, and we expect rapid adoption of the AXi 940 in these important market segments.”

Two systems shipped in April, with the third scheduled for June, Rudolph said.

 

Related jobs

Systems Engineer- Automation - Rudolph Technologies - Budd Lake, 23 September 2008

Factory Start Up Director/Manager (Solar Factory Operations) - Applied Materials - , 07 August 2008

Technical Support Engineer - Carl Zeiss SMT, Inc. - Peabody, 10 August 2007

Electrical engineering - Axcelis - Beverly, 10 August 2007

Senior Applications Engineer - Axcelis - Beverly, 09 August 2007

Related articles

New Product: Rudolph reduces CoO for macro defect inspection with new AXi 940 module - 15 May 2008

Tool Order: Major Asian foundry places multiple Suprema order with Mattson - 14 July 2008

New Product: E25 from Rudolph automates defect classification at the bevel-edge - 30 March 2006

Tool Order: Rudolph wins multiple WaferWoRx 300 Probing system deal - 04 September 2008

Rudolph ships new Explorer Inspection Cluster and installs Macro Inspection system - 03 December 2008

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: