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New Product: Brion supports ASML’s Double Dipole Lithography technology |
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Sep 19, 2007 at 04:37 PM |
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 Product Briefing Outline: Brion Technologies, an ASML company, has added significant options to two key product lines, Tachyon OPC+ and LithoCruiser. Combined with the recent shipments of high NA immersion scanners, Tachyon OPC+ version 7.06 and LithoCruiser version 2.2 are specifically designed to further enhance the accurate representation and optimization of today’s most advanced scanners for critical process development of memory and logic applications.
Problem: Tachyon OPC+ now provides an optional full-chip implementation of ASML’s patented Double Dipole Lithography (DDL). DDL enables semiconductor manufacturers to create smaller chip features by splitting dense circuit patterns into horizontal and vertical masks, then exposing them sequentially. DDL allows chip manufacturers to perform advanced 0.30 k1 imaging. Compared to two-etch double patterning, DDL lowers IC production costs and reduces cycle time by using only one etch step.
Solution: Additionally, Tachyon OPC+ supports a Model-based Scattering Bar Placement option that uses a patented Brion technique to ensure optimal placement of sub-resolution assist features. This model-based approach – calibrated to actual scanner and fab production results – reduces the time required to optimize a lithography solution. LithoCruiser 2.2, Brion’s simulation software suite for analyzing and optimizing lithography processes, adds several new options, including Source-Mask Optimizer (SMO). LithoCruiser’s SMO incorporates ASML scanner capabilities and model-based optical proximity correction (OPC) to improve the contrast and resolution of low-k1 repetitive chip features. Several major semiconductor makers are beginning to use SMO to enhance their advanced low-k1 lithography programs, according to the company. LithoCruiser also now features Batch Optimizer, a new software capability in the NA/sigma and OPC optimizer option. Batch Optimizer is intended to speed customers’ process development simulation flow by providing multi-step sequencing for complex optimizations, such as optimizing scanner settings to match critical dimensions through pitch of multiple scanners.
Applications: Low-k1 advanced lithography
Platform: Source-Mask Optimizer (SMO) is an ASML proprietary software option in LithoCruiser that simultaneously optimizes the ASML scanner illumination shape/settings and the model-based OPC for critical low k1 memory core features. SMO features include: full integration with access to LithoCruiser’s on-board ASML scanner specification database, multi-clip optimization with weighting, overlapping process window and mask error enhancement factor (MEEF) as metrics.
Availability: September 2007 onwards.
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Product Briefings 
