Home
News
Blogs
Fabtech Jobs
Product Briefings
Going Places
300mm Activity Reports
Core Sections
Wafer Processing
Lithography
Fab management
Materials & Gases
Critical Components
Cleanroom
EHS
 
Find

GlobalSpec - The Engineering Search Engine
 
Home arrow Going Places arrow Recruitment News arrow Intel donates 200mm process line to Chinese University
Intel donates 200mm process line to Chinese University Print E-mail
Sep 10, 2007 at 09:54 AM
As part of Intel Corporation's plans to build a chip-set 300mm front-end fab in China that it expects to come on stream in 2010, the company is donating a complete line of 200mm process equipment to the Dalian University of Technology and the Dalian Municipal Government.  The donation will establish a Semiconductor Technology Institute for training purposes to assist Intel in recruiting the right graduates for the new fabrication facility.

"Local talent development is a key component to our fab network strategy," said Wee Theng Tan, Vice President of Corporate Affairs Group and President of Intel China. "We're partnering with the Dalian University of Technology and the Dalian Municipal Government to establish the Semiconductor Technology Institute and donating a 200 mm wafer process line for training purposes. In the future, this Semiconductor Technology Institute will foster world-class talent for the IT industry in China and around the globe."
Intel's investment in Fab 68 sets its total investment in China to close to US$4 billion.

Intel broke ground on Fab 68 in northeast China last week, which is expected to cost a total investment of $4 billion over several years.
Readers' comments



Bookmark with:
DeliciousDiggredditStumbleUpon

Visit Fabtech Jobs websiteSubscribe to Fabtech weekly newsletter

Related articles
Intel starts construction of first fab in Asia  (10/09/2007)
Spin wins with Intel’s Fab 68  (10/09/2007)
India Semiconductor Association creates first honors list  (31/07/2007)
Intel selects greenfield site in China for 300mm fab  (26/03/2007)
Ex-Intel VP joins Silecs Board of Directors  (21/12/2006)

Related jobs
Regional Sales Director Europe (m/f) - Analog ICs  (Munich, 08/04/2008)
Engineering Project Manager  (Alzenau, 28/03/2008)
Manager, Facilities and Support Services  (PERRYSBURG, 19/03/2008)
Senior Component Design Engineer  (Intel Shannon, Co Clare, Ireland, 19/03/2008)
Customer Engineer  (, 04/03/2008)