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Lam Research enters through-silicon via etch market |
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Aug 21, 2007 at 02:13 PM |
 Lam Research has claimed to be the first equipment supplier to ship a 300mm 3-D IC through-silicon via (TSV) etch tool. Although not officially launched separately, the 2300 ‘Syndion' etch system is expected to be in production during the first half of 2008. The company said that it had been developing the technology for over two years.
"We believe we are the first supplier to ship a 300mm system for TSV etch applications," said Lam Research's Jackie Seto, Managing Director of Software, MEMS, and 3-D IC Products, "and, by leveraging our extensive 300mm and MEMS deep silicon etch production experience, we are taking a leading role in establishing the benchmarks for these challenging etch applications."
The company said customers were at the early stages of developing the technologies that will cost-effectively enable interconnects for die-to-die and wafer-to-wafer stacking over conventional wire-bonding technologies.
However, Lam Research stated that it had been able to create etched vias ranging from 2 to 100 microns wide with depths of 20 microns to greater than 400 microns, while maintaining customers' required profiles.
The Syndion system is built on Lam's 2300 platform that can be configured for both 200mm and 300mm wafers and uses its patented high-density TCP planar plasma source.
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