Problem: Until recently, the Semiconductor Industry has had to stick-build the support systems for manufacturing equipment. According to NEHP, stick-built construction compared to pre-designed modules had a time to installation penalty of between 17 and 47 percent. The cost of installation disadvantage was put at 10 to 20 percent and a footprint penalty of between 10 and 15 percent. The company also claims that by using pre-designed modules on-site labor requirements can be reduced by 44 percent and the overall complexity of procurement reduced due to fewer vendors and purchase order requirements.

Solution: NEHP modules replace complicated and costly stick-built gas and water support systems with pre-designed units that fit conveniently into the fab room floor or sub-fab room, depending upon the application. This modular method for 200mm and 300mm tools was developed by NEHP for fast and easy integration into fabs pre-existing process while simplifying design, pre-purchase, and installation. The use of 3D drawings streamlines the engineering approval procedures while 2D submittal assists architectural planning and layouts. The company claims that overall modular systems reduce development costs by 22 percent and on a per-tool basis by 14 percent.

Applications: NEHP modules are pre-designed and customized for specific tool types that include tools designed and built by, Applied Materails, ASML, Canon, DNS, FSI, Hitachi, KLA-Tencor, Kokusai, Lam Research, Nikon Precision, Novellus, SEZ Group, Tokyo Electron and Varian Semiconductor Associates.

Platform: The family of modules includes inert gas, process cooling water, de-ionized water, and chemical process floor modules for tool applications. Sub-fab applications like complete utility rack modules, vacuum and abatement modules, and a variety of general utility tool requirements are also available. The family of modules is engineered to be tool OEM specific.

Availability: July 2007 onwards.

Caption: NEHP Gas Module

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Contact NEHP at www.nehp.com