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Home arrow News arrow Cleanroom arrow $19 billion required to convert 200mm memory production to 300mm
$19 billion required to convert 200mm memory production to 300mm Print E-mail
Jul 26, 2007 at 11:58 AM
ToshibaAccording to Steve Newberry, President and CEO of Lam Research, memory manufacturers will need to spend approximately $19 billion to replace production on 200mm wafers with 300mm wafers as 200mm fabs become un-competitive both at a technology and die cost level. Newberry detailed the shift required during a conference call with financial analysts.

"We believe that by the time 2007 is completed, $2 billion out of that $19 billion will have then completed," noted Newberry. "It's also possible that in 2006, another one or two may have occurred out of that $19 [billion]."

Newberry may have been referring to 2006 with respect to Hynix and or Samsung both of which have stated that fab conversions were being reviewed but have provided little further detail.

The Lam Research executive believes that between $16 and $17 billion will need to be spent over the next three years to replace 200mm memory capacity. In 2008 as much as $5 billion could be spent on conversions, Newberry noted.


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