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EKC Technology teams with IMEC on new post-CMP cleaning solutions |
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Jul 12, 2007 at 02:00 PM |
 DuPont Electronic Technologies has said that its EKC Technology division will team with IMEC as an Industrial Affiliate in 45nm and 32nm technology development programs with the aim to produce new post-CMP cleaning solutions for Cu/low-k scaling challenges.
"The need for collaboration in new materials development is well-recognized by the semiconductor industry, and IMEC has consistently demonstrated a proven model for success in this area" said Douglas Holmes, Director of marketing, EKC Technology - DuPont Electronic Technologies. "We look forward to working closely with the other industrial affiliates to advance and commercialize enabling technologies for advanced interconnects."
"The collaboration with DuPont Electronic Technologies will enable us to evaluate the performance of various EKC post-CMP cleaning solutions, stated Serge Vanhaelemeersch, department Director of Advanced Materials & Process Steps at IMEC. "It will also allow us to obtain generic knowledge that can explain phenomena observed during post-CMP cleaning."
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