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Product Briefing Outline: KLA-Tencor launched its latest range of tools to the 28xx brightfield inspection platform, featuring specialized optical configurations intended to solve the unique defect detection challenges of sub-55nm memory and sub-45nm logic chips. Both the 2810 system for memory devices and the 2815 system for logic use the full-spectrum illumination technology that is designed to capture the broadest possible range of defect types, including yield-critical immersion lithography defects. The system's production throughput at sensitivity has more than doubled for many applications, compared to the previous 2800 system.

Problem: The inspection requirements of memory and logic chips have become quite distinct at 55nm/45nm. In both cases, chipmakers need greater inspection sensitivity to capture all defects of interest, as well as higher speed to quickly ramp new processes. These factors require significant enhancements to brightfield inspection tools that best suit the needs of the different manufactured devices and the difference in sampling strategies and process materials employed by chip manufacturers.

Solution: The 2815 system includes upgrades to the hardware and software algorithms that address defects specific to logic designs. KLA-Tencor claims that the system's specialized optical modes, featuring the smallest pixel, are designed to enable the broadest defect type capture on the complex geometries and new materials found in sub-45nm logic devices. For sub-55nm memory applications, the new 2810 inspection system features memory-specific optical modes and algorithms that enable the detection of bridges, voids, and other critical defects on both array (repeating) and periphery (non-repeating) structures.  Since the optimal inspection wavelength needed to capture all critical defects varies with material, pattern geometry and design rule, the 281x-series tools utilize a tunable full-spectrum illumination source covering DUV, UV and visible wavelengths. This technology provides improved defect contrast, nuisance suppression and the high resolution required to detect critical defects on an extended range of layers, devices and design rules.

Applications: The 2815 system is used for logic IC defect inspection needs for sub-45nm nodes. The 2810 system is used for memory devices for sub-55nm nodes.

Platform: New ease-of-use features, common to both 2810 and 2815, reduce the inspector's recipe optimization time by up to approximately 50 percent.  The 281x system's advancements in automated defect binning further improve the quality of the defect Pareto, enabling faster identification and resolution of the root cause, according to the company.  

Availability: June 2007 onwards.