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TSMC and UMC in top 5 installed wafer capacity rankings, notes IC Insights |
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Jun 28, 2007 at 12:30 PM |
 According to a new study not previously undertaken by market research firm IC Insights, Samsung, TSMC, Intel, Toshiba, and UMC had the five largest shares of the world's wafer capacity at the end of 2006, with combined capacity of just over 2.9 million wafers per month (in 200mm-equivalent wafers), which included all wafer sizes.
The top 5 accounted for 32 percent of total wafer capacity in 2006. Expanding the rankings to the Top 10 saw capacity control reach 48 percent of the installed wafer base.
From a geographical perspective, Taiwan stands out with three chip manufacturers in the Top 10, two from South Korea, two in the United States, two in Japan, and one in Europe, according to the report.
The market research firm noted that the influence of foundries was increasing as fewer companies build 300mm fabs and that a significant level of installed capacity is controlled by a only a small number of companies.
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