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New Product: Advanced circuit edits handled by FEI’s V600CE FIB tool |
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Jun 19, 2007 at 02:24 PM |
 Product Briefing Outline: FEI has launched the V600CE - a new member of its V600 focused ion beam (FIB) family of circuit edit tools. The V600CE is claimed to enable faster semiconductor design validation and performance optimization on today's 65nm-and-below devices due to its advanced ion column technology, versatile gas delivery system, and advanced end-pointing control.
Problem: Circuit editing is an alternative to time-consuming mask and fabrication iterations, enabling faster verification and prototyping of new designs. However, as semiconductor geometries decrease to 45nm, and new materials are introduced, successful FIB-based circuit edit becomes more challenging. The V600CE is specifically designed to increase success rates, reducing development costs and time-to-market.
Solution: The V600CE improves etching planarity with its ‘NanoChemix' gas delivery system. Innovative gas handling accommodates a wide range of precursors for etching and deposition, and gas mixtures can be used to improve electrical performance of insulator depositions. The unique tri-nozzle delivery provides a symmetric, high-flux flow of agents. A dedicated central nozzle delivers the precursor for metal depositions, and dual opposing nozzles eliminate the shadowing that occurs in trenches milled using single-nozzle systems. The new system also includes a dynamic end-point solution that improves operator control during critical applications, according to the company. Live imaging of the active pattern is displayed on the user interface, and both stage current readings and secondary electron intensity for each active pattern are graphically displayed. The combination of these graphical monitors with the live milling image provides reliable end-pointing, resulting in higher edit success rates.
Applications: All types of circuit editing.
Platform: With its five-axis piezo stage, the V600 platform offers tilt and cross-sectioning capabilities on a wide range of samples.
Availability: June 2007 onwards.
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Wafer Processing 