|
10th Edition: A Cleaning Technology for Improved CMP Performance, Productivity and Integration |
|
|
|
Feb 04, 2005 at 09:40 AM |
|
GREG WILLITS & BRIAN FRASER, VERTEQ, Inc., Santa Ana, CA, USA ABSTRACT
As
CMP processing matures, the combined polisher and cleaner equipment set
must achieve higher levels of performance and productivity. A new
cleaning technology based on single-wafer megasonics is investigated
for its ability to improve the productivity of CMP through elimination
of brushes and the use of an embedded integration architecture.
 A Cleaning Technology for Improved CMP Performance, Productivity and Integration
|
Wafer Processing 
