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Tool Order: ASE places multiple etch tool order with Aviza for 3D packaging |
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May 31, 2007 at 02:07 PM |
 Advanced Semiconductor Engineering (ASE) has placed a multiple system order with Aviza Technology for its Omega i2L etch system. ASE will use the etch systems at its Kaohsiung, Taiwan R&D facility for advanced 3D packaging development, followed by implementation into its production fabs.
"Through Wafer Vias (TWV) or Through Silicon Vias (TSV) has become the focus of advanced package technology development as companies are realizing limitations in conventional packaging in terms of size reduction and performance improvement," said Brandon Prior, a senior consultant with Prismark Partners. "As companies sort though the manufacturing and business logistics challenges common with any new technology, we expect to see increased momentum and developments coming from leading IDMs, foundries and merchant packaging houses. Prismark expects several applications of 3D wafer technology to involve the use of integrated passives on die, or as part of a silicon interposer."
"3D packaging is an emerging growth market," said Kevin Crofton, Vice President and General Manager, PVD/CVD/Etch Business Unit of Aviza Technology, Inc. "Aviza is uniquely positioned in this arena, as our portfolio of etch and deposition systems provide us an opportunity to develop and deliver fully integrated process solutions for TWV applications. We concentrate a significant portion of our R&D spending to develop key TWV process steps including plasma etch, dielectric CVD liners, metal barrier and seed deposition, and we are very proud to have been selected by such a distinguished industry leader such as ASE. Aviza looks forward to supporting ASE's long-term development and production needs in advanced packaging."
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