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TSMC links with SVTC on novel processes |
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May 30, 2007 at 02:39 PM |
 TSMC has struck a deal with SVTC Technologies to enable novel ICs to move from the lab to fab in a more efficient manner. A key aspect of the partnership is to enable the transfer of novel structures and materials developed at SVTC into mainstream foundry processes at TSMC, opening up new business opportunities for the foundry.
"There are more and more applications in the semiconductor industry being developed which use novel structures and new materials," stated Dave Bergeron, SVTC Technologies' CEO. "SVTC is uniquely placed in the emerging value chain to help semiconductor development teams from both fabless and integrated device manufacturers (IDMs) to fully develop their new concepts before taking them into volume production. We are especially pleased to work with TSMC as our foundry partner in the commercialization of these new concepts."
"This strategic alliance expands the TSMC ecosystem to enable more innovations by allowing companies, especially those who need special equipment, to develop products at SVTC and transfer accepted business smoothly to TSMC manufacturing," said Ken Chen, Director of Mainstream Technology Marketing, TSMC.
SVTC claims to have expertise in the MEMS, bio-tech, hi-voltage and photovoltaic processing areas at its 200mm facility. TSMC has a portfolio of 200mm fabs that have the capacity to accommodate trailing-edge novel IC fabrication.
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