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Hynix joins other major memory manufacturers in IMEC’s sub-32nm research |
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May 24, 2007 at 04:56 PM |
 IMEC has announced that Hynix Semiconductor has joined its research and development program for sub-32nm memory processes, resulting in all major memory manufacturers collaborating at IMEC's 300mm R&D fab in Belgium.
"With facing various challenges in developing next generation technologies, difficulty and risk have continually increased," said Dr. Park Sung-Wook, Executive Vice President and head of R&D Division, Hynix Semiconductor. "By joining IMEC and collaborating with industry-leading partners, we expect to lessen the risk for developing leading-edge, cost-effective technology and contribute to the growth of the semiconductor industry."
As part of the agreement, Hynix will collaborate within IMEC's advanced lithography program addressing both immersion and EUV lithography challenges and within IMEC's non-volatile memory program.
Work is also being directed at floating gates, nitrides as well as advanced high-k dielectrics.
Elpida was the most recent memory manufacturer to join the IMEC program, which now includes Hynix, Elpida, Micron, Qimonda and Samsung.
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