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SEMATECH selects Carl Zeiss SMT’s mask metrology technology for R&D work |
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May 24, 2007 at 04:40 PM |
 SEMATECH has undertaken a detailed competitive evaluation program to identify a best in class technology for advanced pattern placement metrology needs with the result that Carl Zeiss SMT has been selected to supply the R&D organization with the required tools.
"The acceleration of overlay accuracy requirements is driving a paradigm shift in mask registration technology," stated Michael Lercel, Director of Lithography at SEMATECH. "Whether 193nm double exposure, EUVL, nanoimprint, or high-index immersion lithography, the ability to measure mask registration on both the global and local scale is an enabling technology."
"Our concept has a number of fundamental advantages", noted Dr. Oliver Kienzle, member of the board of Carl Zeiss SMT's SMS division. "It is future-oriented, flexible towards emerging lithography solutions, enables in-die registration measurements, and covers more than just one technology generation."
Although the tool has yet to be built and supplied, Carl Zeiss SMT believes the system will finally enable mask manufacturers to measure position deviation of photomask features with ultra-high precision and accuracy as is required to meet the challenging future overlay requirements.
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