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Intel’s 45nm chips go lead-free |
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May 22, 2007 at 02:12 PM |
 Intel has said that with the move to 45nm processing it will replace its remaining 5 percent lead content in bump packaging with a proprietary tin/silver/copper alloy combo. The lead-free microprocessors are due in the second half of 2007, according to Intel.
"Intel is taking an aggressive stance toward environmental sustainability, from the elimination of lead and a focus on greater energy efficiency of our products to fewer air emissions and more water and materials recycling," said Nasser Grayeli, Intel vice president and director of assembly test technology development, Technology and Manufacturing Group.
Intel's packaging includes pin grid array, ball grid array and land grid array designs that will all become lead-free in microprocessors later this year. In 2008, the company will also transition its 65nm chipset products to 100 percent lead-free technology.
The term "Lead-free / Pb-free" means that Pb has been removed where required by the RoHS legislation. Pb may exist as an impurity below 1000ppm.
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| Senior Technical Program Manager (Dublin, Ireland, 02/04/2008) | | Manager, Facilities and Support Services (PERRYSBURG, 19/03/2008) | | Senior Embedded Design Support Engineer (Shannon, Co Clare, Ireland, 19/03/2008) | | Embedded Support Engineer (Intel Shannon, Co Clare, Ireland, 19/03/2008) | | Senior Component Design Engineer (Intel Shannon, Co Clare, Ireland, 19/03/2008) |
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