Home
News
Blogs
Fabtech Jobs
Product Briefings
Going Places
300mm Activity Reports
Core Sections
Wafer Processing
Lithography
Fab management
Materials & Gases
Critical Components
Cleanroom
EHS
 
Find

GlobalSpec - The Engineering Search Engine
 
Home arrow Lithography arrow Articles arrow Edition 10 arrow 10th Edition: Some Challenges for Mask-Making to Keep Up With th...
10th Edition: Some Challenges for Mask-Making to Keep Up With the Roadmap Print E-mail
Jun 03, 1999 at 09:17 AM

Rik Jonckheere, Kurt Ronse & Jan Wauters, IMEC, Leuven, Belgium

ABSTRACT

The 1997 SIA Roadmap Mask Table does not unambiguously specify the quality factors that a high-end mask should meet, nor is it felt to be sufficiently complete. Linewidth control is presently in the focus, and the growing attention to the mask error factor (MEF) is a sign of the concern. Additional mask imperfections may cause problems at high resolutions. The authors suggest that a criterion of "pattern fidelity" would be helpful in assessing mask quality. 

10th Edition: Some Challenges for Mask-Making to Keep Up With the Roadmap
Readers' comments



Bookmark with:
DeliciousDiggredditStumbleUpon

Visit Fabtech Jobs websiteSubscribe to Fabtech weekly newsletter

Related articles
15th Edition: Advanced Mask-Making with a Variable-Shaped Electron Beam  (02/01/2002)
10th Edition:Micro-Vibration Criteria for 300 mm and Beyond  (03/06/1999)
10th Edition:Construction Challenges for the 300 mm Fab  (03/06/1999)
10th Edition: Treatment of Pyrophoric Effluents  (03/06/1999)
10th Edition: 0.15µm Lithography with KrF  (03/06/1999)

Related jobs
Product Marketing Manager  (San Jose, 14/09/2007)
E Beam Site Engineer  (San Jose, 10/08/2007)
Software Engineer  (Santa Clara, 09/08/2007)
Algorithm Development Engineer  (Santa Clara, 09/08/2007)
Senior Algorithm Development Engineer  (Santa Clara, 09/08/2007)
Download
Subscribe
300mm