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Home arrow News arrow Wafer Processing arrow Spansion teams with TSMC on 40nm NOR flash development
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Spansion teams with TSMC on 40nm NOR flash development Print E-mail
May 15, 2007 at 02:55 PM
TSMCSpansion and TSMC have signed a definitive agreement to begin joint development of variations of MirrorBit flash technology at 40nm and below. The deal includes variations of the core product as well as production processes that extend the foundry relationship established last year with production of 110nm and 90nm NOR devices.

"MirrorBit is a logic-based platform technology that allows massive amounts of integration," said Bertrand Cambou, president and chief executive officer of Spansion. "TSMC has remarkable process technology development expertise and we look forward to working with them to leverage MirrorBit technology into new areas."

"Spansion's technology and design expertise have made it a Flash memory leader," said Rick Tsai, president and chief executive officer of TSMC. "Collaborating with Spansion expands our technology portfolio and increases our participation in the fast-growing Flash memory business. With our extensive 300mm manufacturing experience, the joint force marks a new milestone in advancing the development and production of Flash technology."

TSMC has been producing Spansion flash memory at the 110nm node since the second quarter of 2006 using 200mm wafers. The production ramp at 90nm is expected to be built on 300mm wafers in the middle of 2007.
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