Online information source for semiconductor professionals

Next-Generation Materials in Semiconductor Processing: Manufacturing, Handling and ESH Issues

Popular articles

Micron moving fast on Hynix in Q208 NAND flash rankings, says iSuppli - 19 August 2008

Numonyx to close California Technology Center - 12 August 2008

Qimonda starts major reorganization: exits PC DRAM market - 13 October 2008

Micron close to Inotera share purchase, says Gartner - 06 October 2008

Applied Materials sees higher CapEx spending for 2009 - 15 August 2008

GAUTAM BHANDARI, ATMI, Danbury, CT, USA

ABSTRACT

Semiconductor processing in the next few years will employ several new materials. This poses chemical and risk management challenges. In this article the regulatory environment in the United States is described. Some engineering solutions are discussed. An effective strategy uses both risk management tools and engineering solutions.
Download Please login to download the paper. No account yet? Please register. It's free!

Related jobs

Semiconductor Photo Line Maintenance Technician - AMI Semiconductor - Pocatello, 02 October 2007

Design Engineer/System Architect - AMI Semiconductor - POCATELLO, 10 August 2007

Diffusion Engineer - AMI Semiconductor - Pocatello, 10 August 2007

Analog IC Design Engineer - AMI Semiconductor - Austin, 10 August 2007

Analog Design Engineer - AMI Semiconductor - Sunnyvale, 10 August 2007

Related articles

Developments in Ceramics for Semiconductor Processing - 01 December 1999

Taking control of the copper process at 65 nmTaking control of the copper process at 65 nm - 01 December 2003

The changing role of copper in IC manufacturing - 01 December 2003

Photoresist Processing Tool-Based Advanced Technologies for DUV Lithography and Low-k Spin on… - 01 June 2000

Automated handling: Unsung hero or enemy of the state? - 01 June 2005

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: