In Ed's blog Dan details the important basics of the complete process to create what turns out to be large airgaps rather than a porous low-k technology I thought it was referring to!

One note worth mentioning here is the fact that the self-assembly aspect doesn't have to be used in for all the applicable layers as a standard litho step can do exactly the same job and is cheaper for some layers as it uses a standard photoresist!

It's still a breakthrough of kinds with the integration of a diblock polymer process for a few layers, but no where near the significance IBM originally touted.

Now who would have guessed at such a thing?

The SST/ Ed Korczynski blog with the IBM interview can be viewed here;

(http://www.pennwellblogs.com/sst/eds_threads/)