Home
News
Blogs
Fabtech Jobs
Product Briefings
Going Places
300mm Activity Reports
Core Sections
Wafer Processing
Lithography
Fab management
Materials & Gases
Critical Components
Cleanroom
EHS
 
Find

GlobalSpec - The Engineering Search Engine
 
Home arrow Critical Components arrow Articles arrow Edition 32 arrow 32nd Edition: Cost of ownership challenges in front-end ...
32nd Edition: Cost of ownership challenges in front-end thermal processes Print E-mail
May 01, 2007 at 04:45 PM

Alan Levine, Jasen Sanders, CA, USA

ABSTRACT

The use of new ultrapure poly silicon furnaceware has a dramatic impact on the cost of ownership for the entire LPCVD polysilicon process. Benefits are demonstrated in cost reduction and increased productivity. Further benefits are demonstrated for yield, which is quantified in cost of ownership as a change in scrap costs. Sensitivity analysis allows these results to be extrapolated to a wide range of situations.



32nd Edition: Cost of ownership challenges in front-end thermal processes
Readers' comments



Bookmark with:
DeliciousDiggredditStumbleUpon

Visit Fabtech Jobs websiteSubscribe to Fabtech weekly newsletter

Related articles
32nd Edition: Deep trench metrology challenges for 75nm DRAM technology  (20/12/2006)
32nd Edition: Lithography cell productivity improvement approaches  (20/12/2006)
32nd Edition: Fabless/foundry DFM: 45nm and beyond  (20/12/2006)
32nd Edition: CMP chemistry and materials challenges for ultra low-k integration  (20/12/2006)
32nd Edition: Intel's EHS facilities equipment procurement process   (20/12/2006)

Related jobs
Sr. Equipment Engineer-Concept 2 Platform, CVD  (Phoenix, 24/03/2008)
Mechanical Design Engineer  (San Jose, 14/09/2007)
Mechanical Design Engineer  (San Jose, 14/09/2007)
Mechanical Design Engineer  (San Jose, 14/09/2007)
Account/Sales Manager - Belgium - Semiconductors  (, 29/08/2007)
Subscribe
300mm