Home
News
Blogs
Fabtech Jobs
Product Briefings
Going Places
300mm Activity Reports
Core Sections
Wafer Processing
Lithography
Fab management
Materials & Gases
Critical Components
Cleanroom
EHS
 
Find

GlobalSpec - The Engineering Search Engine
 
Home arrow Cleanroom arrow Edition 32 arrow 32nd Edition: Site selection for semiconductor manufacturing facilities - current prac...
Cleanroom Product Briefs   RSS Feed
Product Briefing Outline: NEHP has introduced a family of modules that help tool installers dramatically decrease the time, cost and complexity of a fab installation. The new line features a  Read More
Product Briefing Outline: Purafil has introduced its 2nd Generation MediaPAK Disposable Plastic Module for clean air filtration systems. The module features the new Taper Fit Closure (TFC), which offers  Read More
Product Briefing Outline: Integrated Dynamics Engineering (IDE) has launched its generation AWP 300-2 wafer sorter. The AWP 300-2 uses a unique dual robot design that is claimed to achieve reliable  Read More
32nd Edition: Site selection for semiconductor manufacturing facilities - current practice and... Print E-mail
Dec 14, 2006 at 03:45 PM

Steffen Weiser, IBM - Plant Location International (PLI)

ABSTRACT

Globalization in the last couple of decades has led to an unprecedented geographical expansion of economic activity, including a significant shift of (production-related) activities towards developing countries. Although developing countries can be attractive as low cost operating platforms and potential future markets, companies have to be aware of certain pitfalls when expanding into these countries. 


32nd Edition: Site selection for semiconductor manufacturing facilities - current practice and future trends
Readers' comments



Bookmark with:
DeliciousDiggredditStumbleUpon

Visit Fabtech Jobs websiteSubscribe to Fabtech weekly newsletter

Related articles
32nd Edition: What comes after fab-lite? The emergence of focused-manufacturing and collaborative...  (02/05/2007)
32nd Edition: Short-interval detailed production scheduling in 300mm semiconductor manufacturing...  (20/12/2006)
32nd Edition: Fabless/foundry DFM: 45nm and beyond  (20/12/2006)
32nd Edition: Intel's EHS facilities equipment procurement process   (20/12/2006)
10th Edition: Site Analysis, Selection, and Development: Exposed vs. Sheltered High Technology  (03/06/1999)

Related jobs
Development Engineer III - Characterization Tools  (Perrysburg, 02/04/2008)
Design Engineer Manager  (Williston, 15/10/2007)
Electrical Engineer III  (Andover, 07/10/2007)
Service Technician  (Stuttgart, 24/08/2007)
Sales Engineer  (Stuttgart, 16/08/2007)
Download
Subscribe
300mm