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TSMC ramping 300mm fabs aggressively |
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Apr 26, 2007 at 05:07 PM |
 TSMC has revealed its expected capacity additions and 300mm wafer fab ramp rates for 2007, which strongly indicate that the foundry expects significant demand from customers, mostly from the third quarter onwards.
Both of TSMC's operational 300mm fabs will be ramped more significantly in 2007 compared to 2006. Fab 12, TSMC's first 300mm fab, has continued to expand through fab extensions and is now projected to reach 73,000wspm by the end of the year - a 22 percent increase in wafer starts for the year.
Fab 14, TSMC's newer 300mm facility, is expected to ramp to 58,677wspm by the end of 2007, a 40 percent increase in capacity from the beginning of the year when wafer starts averaged 34,333 per month.
However, not only are leading-edge fabs increasing capacity in 2007, its 200mm fabs such as Fab 6 & Fab 8 are both adding approximately 10,000wspm by year end.
TSMC managed capacity in 2Q07 is expected to be 4 percent, reaching 1,968K 8-inch equivalent wafers. Total managed capacity for the year (2007) is expected to be 8,335K 8-inch equivalent wafers, up 18% from 7,062K 8-inch equivalent wafers in 2006.
TSMC noted that 65nm processed wafers had achieved 1 percent of revenues in the quarter and that the ramp would increase significantly through the year.
The foundry also expects to have a 45nm pilot line, capable of 1,000wspm in operation by the fourth quarter.
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