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New Product: Carl Zeiss SMT’s MeRiT MG 45 handles all 45nm mask repairs |
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Apr 25, 2007 at 03:52 PM |
 Product Briefing Outline: Carl Zeiss SMT has introduced its next generation of e-beam mask repair systems, the ‘MeRiT' MG 45, that is capable of handling all mask repair requirements at the 45nm node and below. The MeRiT MG 45 is claimed to be the only repair solution to cover opaque and clear defect repair on both PSM and binary masks in one platform.
Problem: Photomasks with zero printable defects are a key factor in the semiconductor manufacturing process and determine the final quality and yield achieved in the wafer fabs. In addition, mask manufacturers have to face ever new challenging technological requirements as they advance to the 45nm node. The required repair qualities of both the principal circuit structures and the critical shapes of any resolution enhancement technology (RET) that may be applied, such as scatterbars etc., are pushing the limits of all the employed technologies.
Solution: The MeRiT MG 45 is based on Carl Zeiss's emission scanning electron platform with ‘GEMINI' electron optics. It has a specific designed chamber, automated mask loader and a high precision laser interferometric stage. The combination of an electromagnetic and electrostatic final lens provides ultra high resolution at low voltages, 3nm spot size at 1 kV and a maximum beam current of 20nA. Carl Zeiss has developed the proprietary computer controlled five-channel gas injection system to precisely control precursor gas flow. A combination of annular SE (secondary electron) and annular EsB (energy selective backscattered electron) detectors, mounted in the GEMINI column, are specifically optimized for the purpose of high definition imaging and ultimate precision end-pointing.
Applications: Complete process modules (etching and/or deposition) for Cr on Quartz (193nm) and MoSi on Quartz (193nm) masks and EUV masks. It can repair opaque and clear defects on both PSM and binary masks. To further facilitate the repairs, process application modules with specific predefined processes for optimized deposition and etching are available from Zeiss.
Platform: Bulkhead mounted Bay/Chase, Class 1 cleanroom compatible, SEMI S2-0200, SEMI S8-0999, and UL/CSA compliant. Ultra-high resolution patented GEMINI electron-beam column featuring low-voltage operation and Variable Pressure mode
Five-channel gas supply with mini-environment ring injection system, gaseous, liquid, and solid precursors for deposition and etching.
Availability: April 2007 onwards.
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Product Briefings 
