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First 65nm wafers being processed at Spansion’s first 300mm fab |
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Apr 19, 2007 at 06:26 PM |
 Spansion has said that it is almost 6 months ahead of original plans to ramp its first 300mm fab, SP1, in Japan. The news came during a conference call with financial analysts yesterday, where the company stated that it was currently in the process of first silicon success with its 65nm process.
"I am glad to announce that as we speak, we are running the first 65nm wafer in Spansion One [SP1], six months ahead of plan," said Bertrand Cambou, President and CEO of Spansion. "We are currently planning volume production at Spansion One in the second half of this year; we would be ahead of our closest competitor at that time as they will be producing in 200mm factories. The first product on Spansion One to be produced will be 65nm MirrorBit ORNAND, to cost reduce our highly successful 90nm MirrorBit ORNAND solutions for the wireless market. Our entire NOR product portfolio will be deployed in Spansion One as well by year end and these would include our WS, NS and GL family." Cambou also reiterated that it expects to ramp 45nm by mid-2008 at SP1 after successful yields at its R&D line. Spansion said that capital spending used in the quarter amounted to approximately $175 million with future spending in 2007 focused on ramping SP1 with a freeze on capital purchases for Fab 25 in Austin due to a major cost cutting exercise initiated in the quarter to higher than anticipated declines in ASPs. The ramp of 65nm flash devices on 300mm wafers is expected to produce between 20 and 30 percent cost reductions, Cambou noted.
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