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Aviza to license low-k dielectric patents |
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Apr 13, 2007 at 02:16 PM |
 Aviza Technology has said that it now has a suite of low-k dielectric film and process patents that are substantial enough that it wants to arrange licensing contracts to both chip manufacturers and equipment suppliers.
"Aviza has a deep portfolio of unique IP that spans multiple technologies," said Nitin Shah, Vice President of Business Development of Aviza Technology, Inc. "We believe that the addition of this latest low-k patent, along with previously issued patents in this area, enhances our overall IP portfolio. We also believe that the suite of low-k patents granted to Aviza will be of significant interest and benefit to chipmakers and semiconductor equipment manufacturers focusing on low-k deposition technologies, as Aviza's patented processes related to this technology virtually spans the entire spectrum of low-k manufacturing. As a result, Aviza is pursuing active licensing programs for our technology."
The new strategy comes on the back of Aviza being awarded a new U.S. patent (7,153,580) entitled "Low-k Dielectric Inorganic/Organic Hybrid Films and Method of Making" for organosilicon-based silicon-organic-carbon (SiOC) films targeted at intermetal dielectric films containing very low dielectric constant values.
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