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Home arrow Wafer Processing arrow Articles arrow Edition 10 arrow 10th Edition: Compositional Metrology™, A New Tool for Yi...
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10th Edition: Compositional Metrology™, A New Tool for Yield Enhancement Print E-mail
Feb 03, 2005 at 04:57 PM

KENTON D. CHILDS, STEPHEN P. CLOUGH & DENNIS F. PAUL, Physical Electronics, Eden Prairie, MN, USA

ABSTRACT

One of the major challenges for yield enhancement is the ability to accurately identify defects or particles; optical and SEM methods are insufficient. Compositional Metrology™, which provides the defect composition, can furnish the additional information needed. This technique uses Auger electron spectroscopy for compositional analysis. Results of the application of the technique to several defects are described.

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