This is not the first time Lin has highlighted e-beam technology but it's probably the first time he has linked poor potential throughput of EUV tools with a corresponding but better throughput of e-beam tools, should multiple beam technology reach maturity.

Lin has been vocal on EUV issues for some time, especially cost and potential operating costs issues compared to immersion lithography and e-beam. He now thinks EUV is unlikely to make it in time for the 22nm node, and so e-beam is his preferred choice.

If this is indeed true and nothing changes much to improve Lin's perception of EUV, this would be a significant move. Though there are several companies developing multiple e-beam technology for higher throughput applications, the potential demand just from TSMC would be impressive and could catapult the technology into the mainstream.

Don't bank on ASML not getting in on the act and acquiring the technology Lin likes the best!

The DigiTimes story can be viewed here: http://www.digitimes.com/NewsShow/

Update: just saw this on Ed's blog at SST, covering other musings from Bern Lin from SPIE, WELL WORTH a look.

http://www.pennwellblogs.com/sst/eds_threads/