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Home arrow News arrow Wafer Processing arrow TSMC to start 55nm shuttle service in May
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TSMC to start 55nm shuttle service in May Print E-mail
Mar 27, 2007 at 11:51 AM
ImageTaiwan Semiconductor Manufacturing Company has said that it will start running its ‘CyberShuttle' prototyping program for 55nm designs in May, 2007, and expects to operate it on a bi-monthly basis. The 55nm logic process includes general purpose (GP) and consumer (GC) platforms.

Initial production of the 55GP begins this quarter, followed by a 55GC offering later in the year, according to TSMC. The 55nm process is a direct shrink of TSMC's 65nm process. TSMC first offered its 65nm shuttle service in October, 2005.

"TSMC's half node process, including 55nm, is the quickest and simplest way for our customers to be cost competitive in the rapidly changing marketplace," said Jason Chen, vice president of corporate development of TSMC. "TSMC continues to combine manufacturing superiority with a comprehensive design ecosystem to support customers of any size, from startups to multinational giants."

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