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Intel selects greenfield site in China for 300mm fab |
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Mar 26, 2007 at 10:48 AM |
 Breaking a 15-year abstinence in building fabs on greenfield sites, as well as having front-end wafer fabrication facilities in Asia, Intel Corp. has confirmed in a press release that it will be building Fab 68, a 300mm facility in the coastal Northeast China city of Dalian in Liaoning Province, China.
At a projected cost of $2.5 billion, Intel plans to start construction later in 2007 and plans to start production in the first half of 2010. Fab 68 will be dedicated to chipset production rather than microprocessors. News reports from China had previously cited Chinese officials that claimed that Intel will use a 90nm process for the then unannounced facility. Intel has not stated which technology node will originally be used at Fab 68. The U.S. Government has restrictions placed on American companies supplying China with advanced technology.
"China is our fastest-growing major market and we believe it's critical that we invest in markets that will provide for future growth to better serve our customers," said Intel President and CEO Paul Otellini (pictured). "Fab 68 will be our first new wafer fab at a new site in 15 years. Intel has been involved in China for more than 22 years and over that time we've invested in excess of $1.3 billion in assembly test facilities and research and development. This new investment will bring our total to just under $4 billion, making Intel one of the largest foreign investors in China."
With the planned opening of Fab 68 in 2010, Intel will soon have eight 300mm fabs in operation. Locations will include North America, Ireland, Israel and China. Intel is only the second company to build a 300mm facility in China. A JV 300mm fab is operated by Hynix and ST Microelectronics in Wuxi, China.
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| Factory Start Up Director/Manager (Solar Factory Operations) (, 07/04/2008) | | Senior Technical Program Manager (Dublin, Ireland, 02/04/2008) | | Senior Embedded Design Support Engineer (Shannon, Co Clare, Ireland, 19/03/2008) | | Embedded Support Engineer (Intel Shannon, Co Clare, Ireland, 19/03/2008) | | Senior Component Design Engineer (Intel Shannon, Co Clare, Ireland, 19/03/2008) |
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