|
SEMATECH starts new model of collaboration |
|
|
|
Mar 23, 2007 at 11:33 AM |
 SEMATECH has said it has begun a new program-based membership scheme that will be open to equipment and materials suppliers as well as assembly and packaging companies on a project-by-project basis. The research consortium also wants to encourage semiconductor manufacturers not already holding full membership status to join future dedicated R&D programs.
Initially, SEMATECH is opening membership in its 3D Interconnect Program, which was launched in early 2005 to develop technologies for deep through-silicon vias to electrically connect a stack of chips. The goal is to enable the integration of diverse CMOS technologies with emerging technologies such as MEMS and bio-chips in system-in-package approach.
"SEMATECH has long been an important resource for the world's leading chip-makers to share in the costs, benefits, and IP of pre-competitive, advanced technology research," said Polcari. "As a result of demand in the marketplace, we've decided to open specific areas of SEMATECH to companies — suppliers, manufacturers, specialty groups all across our industry — interested in program-based membership. The members of these programs will partner with us to drive and influence developments across the entire technology value chain."
SEMATECH believes that the whole industry requires better ways to collaborate on specific pre-competitive R&D projects that enable better cost control and time-to-market attributes. SEMATECH expects to launch a series of these programs in the near future.
|
News 
