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New Product: 300mm warped wafers can be handled by IDE’s new wafer sorter |
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Mar 13, 2007 at 06:00 PM |
 Product Briefing Outline: Integrated Dynamics Engineering (IDE) has launched its generation AWP 300-2 wafer sorter. The AWP 300-2 uses a unique dual robot design that is claimed to achieve reliable throughput of 150 wafers per hour, as well as provide improved wafer handling safety. IDE is currently shipping the first machines to the Pac Rim and Europe.
Problem: Wafer sorters / transfer tools are critical to any wafer fabrication, or material handling facility. These tools eliminate the manual handling of wafers, and allow fab operators to track each wafer throughout the fabrication process. IDE's AWP 300 Series was first introduced in 2005. This fully upgraded 300mm wafer packer features a new patented end-effector technology for improved safe handling of normal or warped wafers.
Solution: With IDE's newly designed internal wafer buffers and integrated materials reject bins, the AWP 300-2 is claimed to set new standards in overall material handling, including full wafer sorting functionality. Featuring IDE's modular design, the system is compatible with the widest variety of carriers, wafer packs, FOUPs, FOSBs and open cassettes. The patented sensor technology of the AWP 300-2 is considered to be the best in its class for material detection, according to the company.
Applications: 300mm fabs
Platform: Today's AWP 300-2 has grown out of IDE's field tested AWP 200, introduced in 2000.
Availability: March 2007 onwards.
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Product Briefings 
