|
11th Edition: The IMEC Clean: Implementation in Advanced CMOS Manufacturing |
|
|
|
Feb 03, 2005 at 04:19 PM |
|
MARC MEURIS, SOPHIA ARNAUTS, INGRID CORNELISSEN, K. KENIS, M. LUX, STEFAN DEGENDT, PAUL MERTENS,
I. TEERLINCK, R. VOS, L. LOEWENSTEIN & M. M. HEYNS, IMEC, Leuven, Belgium
KLAUS WOLKE, STEAG Microtech, Pliezhauzen, Germany ABSTRACT
This
article describes an implementation of the IMEC Clean for pre-diffusion
cleans in a CMOS process. To avoid metal contamination HCl is added to
the dilute HF. This also ensures particle removal. The particle removal
and metal removal efficiencies are compared with those of an RCA clean.
The results of monitoring of particle levels over 18 months and Fe
concentration over a year are presented. The cost of ownership is also
compared with that of an RCA clean.
 The IMEC Clean: Implementation in Advanced CMOS Manufacturing
|
Wafer Processing 