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11th Edition: Challenges of Electroplated Copper Film and Device Characteristics for Copper |
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Feb 03, 2005 at 04:14 PM |
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MARIA L. PETERSON, ROBERT J. SMALL, TUAN TRUONG & JOO-YUN LEE, EKC Technology, Inc., Hayward, CA, USA ABSTRACT
Planarizing
copper deposited inlays is not a simple problem to solve. The change in
crystallite orientation within the infill affects the polishing
uniformity and processing wafers from different sources can add to the
problems. The various pitfalls are discussed and polishing techniques
explained. By using two stage polishing processes with careful
control of the slurry chemistry and abrasive particle geometry,
excellent surface flatness has been obtained.
 Challenges of Electroplated Copper Film and Device Characteristics for Copper Slurry Design
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Wafer Processing 
