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First full-field EUV exposures |
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Mar 01, 2007 at 02:29 PM |
 Less than six months after taking delivery of the world's first full-field extreme ultraviolet (EUV) research and development tool (an "alpha demo tool", ADT), the College of Nanoscale Science and Engineering (CNSE) of the University at Albany announced the world's first exposed images while using the tool in a development environment.
The $65 million EUV ADT was developed by Netherlands-based ASML. EUV lithography is considered the most likely technology for insertion into manufacturing as early as the 32nm computer chip device node, based on cost-effectiveness and ability to extend to future nodes, according to ASML.
The production of images from the EUV ADT supports the R&D programs of the $600 million International Venture for Nanolithography (INVENT), a global industry-university consortium for R&D, education and technology deployment for future generations of nanolithography applications. INVENT was created with critical support and enabling assistance from the New York State Assembly, led by Speaker Sheldon Silver, and includes world-leading computer-chip manufacturers: Advanced Micro Devices (AMD), IBM, Micron Technology and Qimonda. Other global corporate partners of CNSE, including SONY and Toshiba, also participate in the CNSE EUV programs.
Dr. James Ryan, Professor of Nanoscience and Associate Vice President of Technology at CNSE, comments: "Combined with the availability of EUV photomasks, ASML's earlier demonstration of operating wafer and reticle stages in a vacuum environment and the presence of a critical mass of nanoelectronics tool suppliers and chip manufacturers at CNSE, we look forward to leading the way in the development and commercialization of EUV technology."
ASML has a $400 million R&D center at the New York State Center of Excellence in Nanoelectronics and Nanotechnology at CNSE's Albany NanoTech complex - the International Multiphase Partnership for Lithography Science and Engineering (IMPLSE) - designed to develop nanoscale lithography technologies for future generations of nanochips. The establishment of the ASML R&D Center represents ASML's only 300mm wafer R&D facility located outside of its main headquarters in the Netherlands.
CNSE's Albany NanoTech is a $3.5 billion, 450,000-square-foot complex. The UAlbany NanoCollege houses the only fully-integrated, 300mm wafer, computer chip pilot prototyping and demonstration line within 65,000 square feet of Class 1 capable cleanrooms. Over 1,600 scientists, researchers, engineers, students, and faculty work on site at CNSE's Albany NanoTech complex, including IBM, AMD, SONY, Toshiba, Qimonda, Honeywell, ASML, Applied Materials, Tokyo Electron, and Freescale. An expansion currently underway will increase the size of CNSE's Albany NanoTech complex to over 750,000 square feet, including over 80,000 square feet of Class 1 cleanroom space, to house over 2,000 scientists, researchers, engineers, students, and faculty by the end of 2008.
Courtesy of ASML
By Dr Mike Cooke
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Lithography 
